The DCP500 ic chip making machine can perform electrical performance testing and personalized data writing on small batches of M2M chips, automotive electronic SE (Security Element - security chips), eSIM and other smart devices in various packaging forms such as DFN, QFN, SOP, VSOP, LQFP, etc.
DCP500 can provide flexible sample card testing and small batch order production solutions for global mobile operators, smart device foundries, and automotive electronic security chip manufacturers.
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